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08.04

2026

SEMICON Taiwan 2026
Hartford Showcases the HSM-560 High-Speed Machining Center for Semiconductor Micro-Machining

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As AI, high-performance computing (HPC), advanced packaging, and high-speed data transmission continue to drive the evolution of the semiconductor industry, the demand for higher precision, greater productivity, and superior manufacturing reliability has never been stronger. From IC test fixtures and precision tooling to semiconductor components, every machining process plays a critical role in product quality and production yield.


Recognized as one of the world's most influential semiconductor exhibitions, SEMICON Taiwan brings together leading companies, innovative technologies, and industry professionals from across the global semiconductor supply chain. The exhibition serves as an important platform for technology exchange, business collaboration, and market development while connecting Taiwan's complete semiconductor ecosystem with international partners.


Hartford (She Hong Industrial Co., Ltd.) will participate in SEMICON Taiwan 2026, taking place September 2–4, 2026, where the company will showcase its HSM-560 High-Speed Machining Center at Booth Q5352. Designed for high-precision semiconductor applications, the HSM-560 delivers outstanding machining accuracy, thermal stability, and productivity, providing manufacturers with a reliable solution for next-generation precision machining.

Meeting the Growing Demand for Semiconductor Precision Machining

As semiconductor devices continue to become smaller and more sophisticated, machining requirements for IC test sockets, probe plates, engineering plastic fixture plates, and other precision tooling have become increasingly demanding. Manufacturers are expected to produce smaller features while maintaining exceptional dimensional accuracy, consistent quality, and high production efficiency throughout extended machining operations.


A single semiconductor testing fixture often requires thousands—or even tens of thousands—of precision micro holes. Even the slightest machining deviation may affect probe contact, dimensional consistency, or final product yield. As a result, machining stability, thermal control, and long-term accuracy have become key considerations when selecting manufacturing equipment.


With decades of experience in precision machine tool development, Hartford continues to invest in high-speed spindle technology, machine rigidity, thermal management, and precision assembly. These core technologies enable manufacturers to improve machining quality, increase productivity, and maintain the high level of consistency required by today's semiconductor industry.

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Improving Yield Through Stable and Reliable Machining

For semiconductor applications, productivity alone is not enough. Consistent machining quality over long production cycles is equally essential.


For example, if spindle thermal growth causes variations in hole depth during extended machining, or if spindle vibration affects hole quality, the performance of the finished testing fixture may be compromised. Likewise, insufficient machine rigidity may shorten tool life and increase production costs, especially when machining extremely small features.


Developed specifically for precision semiconductor machining, the HSM-560 combines high-speed performance with exceptional machining stability. The machine is capable of producing ultra-small holes while maintaining excellent thermal stability, spindle accuracy, and long-term machining consistency. These capabilities help manufacturers reduce machining errors, improve product uniformity, and achieve higher production yields.


Supported by Hartford's precision manufacturing process and machine assembly expertise, the HSM-560 provides an ideal balance between machining efficiency and precision, enabling customers to enhance both productivity and product quality.

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The Advantage of Taiwan-Made Manufacturing Solutions

Beyond machine performance, Hartford offers the flexibility, responsiveness, and service advantages that have made Taiwan one of the world's leading machine tool manufacturing centers.


In the semiconductor industry, equipment downtime directly impacts production schedules and operating costs. Hartford provides comprehensive domestic and international after-sales support, together with cloud-based remote service, enabling technical issues to be diagnosed and resolved quickly while minimizing production interruptions.


As semiconductor materials continue to evolve, manufacturers frequently encounter new engineering plastics, composite materials, and specialized machining requirements. Hartford works closely with customers by providing machining trials, process optimization, and customized machine configurations to accelerate the introduction of new products and manufacturing processes.


Compared with standardized solutions from many international brands, Taiwan-made machine tools offer greater flexibility, faster response times, competitive operating costs, and comprehensive local support. These advantages help customers maximize productivity while maintaining long-term competitiveness.

Visit Hartford at SEMICON Taiwan 2026

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SEMICON Taiwan is more than an exhibition—it is a global platform where semiconductor manufacturers, technology providers, and industry leaders come together to explore the future of advanced manufacturing.


From September 2 to 4, 2026, Hartford warmly welcomes visitors to Booth Q5352 to discover its latest high-speed precision machining technologies and semiconductor manufacturing solutions. Our engineering team will be available throughout the exhibition to discuss precision machining applications, semiconductor tooling, and smart manufacturing technologies, demonstrating how advanced machining solutions can improve quality, productivity, and manufacturing competitiveness.


We look forward to welcoming customers and industry partners from around the world to Booth Q5352 and exploring the future of semiconductor precision manufacturing together.


📍 TaiNEX 2, 1F

📅 September 2–4, 2026

📌 Booth Q5352

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